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  • Multichip Packages

    Get the critical features and functions for your design—including high performance, high quality, power efficiency, wide density ranges, small package sizes, and industrial temperature ranges—from our broad portfolio of industry-standard multichip packages (MCPs).

    View Part Catalogs
    Product Family
    Advanced Solutions
    DRAM
    DRAM Modules
    Graphics Memory
    Managed NAND
    Memory Cards
    Multichip Packages
    NAND Flash
    NOR Flash
    Solid State Drives
    Product Technology
    1100
    1300
    2200
    3D NAND Flash
    5100
    5200
    5210
    5300
    7300
    9200
    9300
    Authenta
    Client SSD
    DDR SDRAM
    DDR2 SDRAM
    DDR3 SDRAM
    DDR4 SDRAM
    e.MMC
    e.MMC for Automotive
    e.MMC-Based MCP
    Embedded USB
    Enterprise MLC
    Enterprise SSD
    FortisFlash
    GDDR5
    GDDR6
    Industrial microSD Cards
    Industrial SSD
    Legacy NOR Flash
    LPDRAM
    LRDIMM
    Mini-DIMM
    MLC NAND Flash
    MT25Q
    NAND-Based MCP
    NOR Flash for Automotive
    NOR-Based MCP
    NVDIMM
    NVMe SSD
    Parallel NOR Flash
    RDIMM
    RLDRAM
    SATA SSDs
    SDRAM
    Secure NOR Flash
    Serial NAND Flash
    Serial NOR Flash
    SLC NAND Flash
    SODIMM
    Solid State Drives
    SORDIMM
    TLC NAND Flash
    Twin-Quad NOR Flash
    UDIMM
    Universal Flash Storage
    VLP Mini-DIMM
    VLP RDIMM
    VLP UDIMM
    Wafer Level CSP and KGD NOR Flash
    Xccela Flash
    View Part Catalog

    By Family

    e.MMC-Based MCP
    Quick look
    Benefits
    • Embedded managed NAND and High Performance LPDRAM in a single package
    • Simplified software solutions for complex high density NAND applications
    • Technology
      e.MMC, LPDDR2 SDRAM, LPDDR3 SDRAM, LPDDR4 SDRAM
    • Densities
      e.MMC: 4GB–32GB; LPDRAM: 4Gb–48Gb
    • Package
      WFBGA, VFBGA, TFBGA, POP
    UFS-Based MCP (uMCP)
    Quick look
    Benefits
    • Embedded managed NAND and high-performance LPDRAM in a single package.
    • Enables high-density, low-power storage in a small footprint.
    • Technology
      LPDDR4 SDRAM, LPDDR4X SDRAM, UFS 3D NAND
    • Densities
      UFS: 32GB; LPDRAM: 24Gb (3GB)
    • Package
      WFBGA
    NAND-Based MCP
    Quick look
    Benefits
    • Offers high densities for data-intensive applications
    • Provides high speeds, with x8, x16 and x32 bus widths
    • Enables high reliability with SLC NAND that provides up to 100,000 PROGRAM/ERASE cycles
    • Technology
      LPDDR SDRAM, LPDDR2 SDRAM, LPDDR3 SDRAM, LPDDR4 SDRAM
    • Densities
      NAND: 1Gb - 8Gb
    • Package
      WFBGA, VFBGA, TFBGA, POP
    NOR-Based MCP
    Quick look
    Benefits
    • Simplifies design while speeding performance for low-density applications
    • Reduces active ball count by more than 50% thanks to shared-bus and A/D MUX options
    • Speeds boot-up and extends battery life with execute-in-place (XIP) functionality
    • Supports low-voltage applications (1.8V)
    • NOR Densities
      32Mb - 512Mb
    • Voltage
      1.8V
    • Package
      TFBGA, VFBGA
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